The following shows the features of the major grades of SUMIKASUPER LCP. When selecting a grade, first select the series based on the heat resistance required for the application.
(1) E5000 series
The E5000 series has the highest level of heat resistance among super engineering plastics. Use this when ultra-high heat resistance is especially needed with lead-free solder (dipping) at up to 400°C. However, it has super heat resistance, so the molding processing temperature is also high. Therefore, molding machines with high temperature specifications are needed along with regular maintenance.
(2) E4000 series
The E4000 series is a grade with excellent moldability and good heat resistance. Use this when heat resistance is needed up to 380°C with lead-free solder (dipping) such as for bobbins and relay cases. Since the standard molding temperature is 380°C, molding is possible using standard molding machines.
(3) カジノ シークレット 出 金 方法000 series, カジノ シークレット 出 金 方法000HF series, SV6000 series, and SV6000HF series
Our standard grades are the カジノ シークレット 出 金 方法000 series, カジノ シークレット 出 金 方法000HF series, SV6000 series, and SV6000HF series. These are well-balanced grades that have good mechanical properties and dimensional stability comparable to general-purpose engineering plastics, as well as high moldability, in addition to heat resistance capable of withstanding surface mounting (SMT) of electronic components. These can be used for a wide range of purposes. For applications requiring high dimensional stability and high moldability, select the カジノ シークレット 出 金 方法000HF or SV6000HF series, which have excellent flowability.
(4) SZ series, SR series
The SZ series and SR series are special high-performance compound series with special functionality over existing grades. These are developed from LCP resin for specific applications such as connectors and LEDs. For applications requiring high flowability such as ultra-small parts where the flowability with カジノ シークレット 出 金 方法000HF and SV6000HF is insufficient, select SZ6505HF or SR2506, which have the highest level of flowability among LCPs.
(1) Glass fiber reinforced grade
This grade of LCP reinforced with glass fiber has excellent mechanical strength and heat resistance. Characteristics such as mechanical strength, heat resistance, dimensional stability, and moldability change according to the length and amount of glass fiber filler.
Table 6-1-1 Glass Fiber Reinforced Grades of SUMIKASUPER LCP
E5000 series | E4000 series | カジノ シークレット 出 金 方法000 series カジノ シークレット 出 金 方法000 series |
カジノ シークレット 出 金 方法000HF series カジノ シークレット 出 金 方法000HF series |
SZ·SR series | |
---|---|---|---|---|---|
Heat resistance requirement level |
Special ultra-high heat resistance |
Ultra-high heat resistance | High heat resistance | High flow | High performance |
Features | Dip-proof solder High temperature resistant reflow Thermal rigidity over 200°C |
High temperature resistant reflow Thermal rigidity over 200°C |
Reflow resistance Standard |
Reflow resistance High flow Low warpage |
Reflow resistance High performance functional specialization |
Standard molding temperature (°C) |
400 | 380 | 360 | 350 | 340-380 |
Milled GF Thin wall, small size |
E5008 E52008 |
E4008 E4009 |
カジノ シークレット 出 金 方法006 カジノ シークレット 出 金 方法008 |
- | SR1009 |
Chopped GF High strength |
E5006L E5008L |
E4006L | カジノ シークレット 出 金 方法006L | カジノ シークレット 出 金 方法007LHF カジノ シークレット 出 金 方法007LHF-MR |
SR1009L |
(2) Glass fiber / inorganic reinforced grade
Grades where LCP is reinforced with glass fiber and inorganic filler have a combination of inorganic filler and glass fiber characteristics, and show high dimensional stability, low warpage, and high flowability while maintaining mechanical strength and heat resistance.
Table 6-1-2 Glass Fiber / Inorganic Reinforced Grades of SUMIKASUPER LCP
E5000 series | E4000 series | カジノ シークレット 出 金 方法000 series カジノ シークレット 出 金 方法000 series |
カジノ シークレット 出 金 方法000HF series カジノ シークレット 出 金 方法000HF series |
SZ·SR series | |
---|---|---|---|---|---|
Heat resistance requirement level |
Special ultra-high heat resistance |
Ultra-high heat resistance | High heat resistance | High flow | High performance |
Features | Dip-proof solder High temperature resistant reflow Thermal rigidity over 200°C |
High temperature resistant reflow Thermal rigidity over 200°C |
Reflow resistance Standard |
Reflow resistance High flow Low warpage |
Reflow resistance High performance functional specialization |
Standard molding temperature(°C) |
400 | 380 | 360 | 350 | 340-380 |
Glass fiber / inorganic reinforced |
E5204L | E4205R | カジノ シークレット 出 金 方法205L | - | SR1205L SZ6709L |
Glass fiber / inorganic reinforced High flow and low warpage |
- | - | カジノ シークレット 出 金 方法809U カジノ シークレット 出 金 方法808L |
カジノ シークレット 出 金 方法807LHF カジノ シークレット 出 金 方法808LHF カジノ シークレット 出 金 方法808UHF カジノ シークレット 出 金 方法808GHF カジノ シークレット 出 金 方法808THF カジノ シークレット 出 金 方法808GHF カジノ シークレット 出 金 方法810LHF カジノ シークレット 出 金 方法810KHF |
SR2506 |
(3) Inorganic reinforced grade
The inorganic reinforced grade generally has better surface properties, higher tensile elongation, and better impact strength compared to the glass fiber reinforced grade. It also has high flowability.
Table 6-1-3 Inorganic Reinforced Grades of SUMIKASUPER LCP
E5000 series | E4000 series | カジノ シークレット 出 金 方法000 series カジノ シークレット 出 金 方法000 series |
カジノ シークレット 出 金 方法000HF series カジノ シークレット 出 金 方法000HF series |
SZ·SR series | |
---|---|---|---|---|---|
Heat resistance requirement level |
Special ultra-high heat resistance |
Ultra-high heat resistance | High heat resistance | High flow | High performance |
Features | Dip-proof solder High temperature resistant reflow Thermal rigidity over 200°C |
High temperature resistant reflow Thermal rigidity over 200°C |
Reflow resistance Standard |
Reflow resistance High flow Low warpage |
Reflow resistance High performance functional specialization |
Standard molding temperature(°C) |
400 | 380 | 360 | 350 | 340-380 |
Inorganic | - | - | カジノ シークレット 出 金 方法807T カジノ シークレット 出 金 方法809T |
- | SZ4506 SZ6505HF SZ6506HF SR2507 |